Technical Lead – Defect Management (TK712FT RM 4367)

Position: Technical Lead – Defect Management (TK712FT RM 4367)

MANDATORY SKILLS – Automotive, Defect Ananlysis, Bug Fixing, BSP, Kernal, HyperV, Boot Loader

Role Overview
We are looking for an experienced Defect Analyst / Defect Manager with strong expertise in automotive embedded platform software, including BSP, Linux Kernel, Hypervisor, and Bootloader. The candidate will be responsible for defect triaging, first level and deep technical analysis, defect ownership tracking, stakeholder coordination, and ensuring timely resolution of issues across system software domains.

Key Responsibilities

• Manage end-to-end defect triaging as per project-defined processes and timelines.
• Perform first level and detailed technical analysis of defects related to BSP, Kernel, Hypervisor, Bootloader, and platform software.
• Analyze logs, crash dumps, core dumps, RAM dumps, DLT logs, console logs, MCU logs, and logcat traces to identify probable root causes.
• Assign defects to the correct domain owner or engineering team based on technical analysis.
• Maintain defect tracking tools such as Jira with accurate status, labels, filters, dashboards, priorities, and ownership details.
• Drive follow-ups with development, validation, integration, platform, and customer teams to ensure timely defect closure.
• Participate in daily defect review meetings, CCB discussions, technical sync-ups, and project status meetings.
• Track newly reported, open, aging, blocked, reopened, and recently fixed defects and provide regular status updates to stakeholders.
• Support customer-facing technical and non-technical discussions related to defect status, issue impact, and resolution planning.
• Ensure defect data quality, process compliance, traceability, and readiness for internal and customer reviews.

Required Technical Skills

• Strong experience in BSP, Linux Kernel, Bootloader, Hypervisor, and System Platform software.
• Good understanding of embedded Linux/Android platform architecture, kernel internals, device drivers, memory management, and boot sequence.
• Hands-on exposure to Bootloader technologies such as U-Boot, secure boot, boot sequence debugging, and platform bring-up.
• Knowledge of Hypervisor-based virtualization concepts in automotive systems, including Linux, QNX, Android, or similar mixed-criticality environments.
• Experience in defect analysis related to board bring-up, drivers, power management, peripheral interfaces, device tree, and system integration.
• Proficiency in log analysis using DLT Viewer, console logs, MCU logs, logcat, crash logs, RAM dumps, and core dumps.
• Understanding of automotive E-Cockpit, infotainment, domain controller, or software-defined vehicle platform architecture is preferred.
• Working knowledge of Git, Gerrit, Jenkins, Jira, Confluence, and Atlassian toolchain.

Tools and Technologies

• Defect Management: Jira, Octane, Confluence, DOORS
• Version Control and CI/CD: Git, Gerrit, Jenkins
• Debugging and Analysis: DLT Viewer, GDB, JTAG, Lauterbach/TRACE32, logcat, serial console
• Embedded Platforms: Linux, Android Automotive, QNX, Hypervisor-based platforms
• Build and Platform Tools: Yocto, Buildroot, Device Tree, U-Boot

Experience and Qualification

• Bachelor’s or Master’s degree in Electronics, Computer Science, Electrical Engineering, Embedded Systems, or a related discipline.
• 5+ years of experience for Defect Analyst role; 8+ years of experience for Defect Manager / Lead role.
• Minimum 3–5 years of experience in automotive embedded software, BSP, Kernel, Bootloader, Hypervisor, or platform software domains.
• Experience working with global customers, cross-functional engineering teams, and distributed development teams.
• Automotive domain experience in infotainment, cockpit, ADAS, domain controller, or software-defined vehicle programs will be an advantage.

Required Behavioral Competencies

• Strong analytical and problem-solving skills with attention to defect details and technical evidence.
• Excellent communication skills to coordinate with engineering teams, project managers, and customers.
• Ability to work under pressure and manage high-priority production or customer-reported defects.
• Strong ownership mindset with the ability to track issues to closure.
• Process-oriented approach with focus on data accuracy, timely reporting, and compliance.

Preferred / Good-to-Have Skills

• Experience in ASPICE, ISO 26262, or automotive software development lifecycle processes.
• Knowledge of Qualcomm, Renesas, NXP, MediaTek, or similar automotive SoC platforms.
• Exposure to Android Automotive, Adaptive AUTOSAR, QNX, or Linux-based cockpit platforms.
• Experience in customer defect review meetings and technical status reporting.
• German language knowledge will be an added advantage for customer-facing programs.

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