Chiplet Connectivity & SystemC/TLM Engineer (IRT510ST RM 4406)

Position: Chiplet Connectivity & SystemC/TLM Engineer (IRT510ST RM 4406)

Work mode : Hybrid

Position Summary
Develop functional and performance models for the company’s chiplet connectivity and high-speed datamovement infrastructure, including UCIe, PCIe, CXL, and die-to-die interfaces.

Education : B.E. / B.Tech / M.E. / M.Tech in Electronics, Electrical, Computer Engineering, or related discipline.

Key Responsibilities

• Connectivity Virtual Modelling: Develop SystemC/TLM models of connectivity components; model transactions, data movement, latency, and bandwidth; develop configurable models for different link configurations; represent software-visible behavior where required.
• AI Scale-Up / Fabric Modelling: Model communication between multiple XPUs/chiplets, develop scalable interconnect/fabric models, and analyze bandwidth, latency, congestion, and utilization to support scale-up architecture exploration.
• Multi-Chiplet / Multi-XPU Scalability: Integrate connectivity models into multi-chiplet configurations and evaluate communication scalability as the number of XPUs/chiplets increases.

Required Technical Skills

• 5–10+ years of relevant SystemC/TLM or connectivity-modelling experience.
• Strong C++ / SystemC / TLM.
• UCIe, PCIe, and CXL.
• Chiplet architecture and high-speed interconnects.
• Transaction-level modelling and performance modelling.

Preferred Skills

• AXI / ACE / CHI.
• Ethernet, UALink, ESUN, SerDes.
• AI/HPC architecture.
• Synopsys Virtualizer.

Project Experience : Hands-on development of SystemC/TLM connectivity or interconnect models (UCIe/PCIe/CXL or dieto-die) used for bandwidth/latency analysis.

Soft Skills

• Strong modelling discipline and attention to protocol-level detail.
• Ability to work closely with the platform architect and performance architect to integrate models
  cleanly

Good to Have

• Experience modelling scale-up fabrics for multi-XPU AI systems.
• Familiarity with SerDes/UALink for next-generation interconnects.

Expected Deliverables

• SystemC/TLM functional and performance models for UCIe/PCIe/CXL and die-to-die interfaces.
• Scalable interconnect/fabric models integrated into multi-chiplet configurations.
• Bandwidth/latency/congestion analysis reports.

Growth Path

• Progress toward Senior Connectivity Architect or Interconnect/ Fabric Architecture Lead roles.

********************************************************************************************************************