sradmin Position: Pad Ring Layout (SI60FF RM 3703)
JD/expectations below: –
- Extensive PAD Ring and Top/Chip level layout experience.
- Good understanding of package/substrate design and package assembly rules related to flip chip designs, BGA, LFCSP etc.
- Experience in IO Pads, ESD clamps and Analog Mixed Signal IP layout
- Layout experience in the following technology nodes is a plus: 180, 40nm and 22nm GF
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Job Category: Others
Job Type: Full Time
Job Location: Bangalore
Experience: 6+ years
Notice period: 0-15 days
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