Position: SAP FI Payment Application Expert – (Digital Payments) (TT70ST RM 4371) Software that makes a differenceThis role is within our Commercial Cluster in the Digital Finance area, responsible for building and maintaining solutions for Volvo Cars payment solution built in SAP. We are now looking for a person with solid skills in SAP Payment …

Position: SAP Material Management (MM) (TT70ST RM 4370) We are seeking an SAP Material Management (MM) expert with 8–10 years of hands-on experience in SAP MM business processes, functionalities, and end-to-end implementations. The ideal candidate will have a strong functional background and a proven track record of delivering complex SAP solutions across both ECC and …

Position: Sr Hardware Engineer for Digital HW+ Engineering (TT90ST RM 4369) OverviewWe are looking for a Senior Hardware Engineer to support HARMAN’s Digital HW+ Engineering initiative. The objective is to integrate simulation into Hardware Engineering development processes and establish a reusable digital component library to enable Model-Based Engineering. Responsibilities Required Profile **************************************************************************************************

Position: Sr Mechanical Engineer for Digital HW+ Engineering (TT90ST RM 4368) OverviewWe are looking for a Senior Mechanical Engineer to support HARMAN’s Digital HW+ Engineering initiative. The objective is to integrate simulation into Mechanical Engineering development processes and establish reusable material and simulation libraries to enable Model-Based Engineering. Responsibilities Required Profile ***************************************************************************************************

Position: Technical Lead – Defect Management (TK712FT RM 4367) MANDATORY SKILLS – Automotive, Defect Ananlysis, Bug Fixing, BSP, Kernal, HyperV, Boot Loader Role OverviewWe are looking for an experienced Defect Analyst / Defect Manager with strong expertise in automotive embedded platform software, including BSP, Linux Kernel, Hypervisor, and Bootloader. The candidate will be responsible for …

Position: Fabric Lead / Data Engineer (TT410ST RM 4366) Experience : 6–10+ years overall experience, with 3+ years in Azure Data Engineering / Microsoft Fabric / Power BI Role Overview We are looking for an experienced Microsoft Fabric Lead to lead the design, development, and implementation of enterprise-scale data and analytics solutions using Microsoft Fabric, …

Position: Embedded Firmware Engineer – I (BB58FT RM 4364) Key Skills:C/C++, ARM Cortex (M33/M0+), Embedded Firmware, Pre-Silicon Validation (RTL & FPGA), Silicon Bring-up, I2C/SPI/SPMI, NFC, HW/SW Debugging. **************************************************************************************************************

Position: Wire Harness (TT26ST RM 4359) Skills required: Creo cabling, schematic design, creo, WH 1. Have responsibility for Routing/ flattening the Harness, Bundle Harness and Schematics understanding.2. Should be able to work individually and/or with a small team actively to secure the deliverables3. Integrate deliveries from cross-functions and secure quality and readiness before releases.4. Ensure …

Position: Mechanical Development Engineer – CAD (TT60ST RM 4358) Job purposeA Mechanical Development Engineer (MDE) is responsible for design and release of components that are used in conjunction within an assembly to meet the overall performance requirements of a product. MDE works in the PowerDrive Systems organization collaborating with Program Lead Engineers and support CAE …

Position: STA Verification Engineer (BB60FT RM 4355) Mandatory Education: BE or MTech (mandatory) Key responsibilities **************************************************************************************************************