Position: AMS SPICE Verification Engineer (BB50FT RM 4387) Role OverviewWe are seeking an AMS SPICE Verification Engineer with 5+ years of experience in analog/mixed-signal simulation and verification at block, subsystem, and chip-top levels. Key Responsibilities Required Qualifications Required Tools Preferred Experience *************************************************************************************************

Position: DMS Verification Engineer (BB50FT RM 4386) Role OverviewWe are seeking a DMS Verification Engineer with 5+ years of experience in analog/mixed-signal behavioral modeling and full-chip verification using SV-RNM, custom UDNs, and UVM. Key Responsibilities Required Qualifications Preferred Skills ***********************************************************************************************************

Position: Validation Engineer (TT810SF RM 4385) Key Technical skills:DV/PV Testing, Risk Analysis, EMI/EMC Validation, OEM Validation Standards, Test Planning Customer Focus AreasAssess risks arising from design changes, determine validation scope, obtain customer approval for testing, justify testing strategy Must-Have Deliverables / CapabilitiesPrepare risk assessments, validation rationale, DV/PV plans, EMI/EMC test plans, execute tests, generate test …

Position: ECAD Engineer (TT810SF RM 4384) Key Technical skills:PCB Layout, High-Speed Design, Altium Designer, SI/PI Awareness, Ethernet, DDR, PCIe, MIPI, GMSL Customer Focus AreasUnderstand and implement design constraints, review and optimize layouts, proactively identify issues and improvements Must-Have Deliverables / CapabilitiesHigh-speed PCB layout development, constraint management, impedance control, routing strategy, DFM/DFT compliance, design reviews and …

Position: Electrical Engineer (TT810ST RM 4383) Key Technical skills:WCCA, MathCAD, Automotive Hardware Design, EMI/EMC, High-Speed Design, Automotive Ethernet Customer Focus AreasAssess design changes, identify impact on existing design, perform engineering analysis, support decision making Must-Have Deliverables / CapabilitiesPrepare WCCA reports, develop strong engineering rationales, defend design decisions with global teams, perform impact analysis and EMI/EMC …

Position: SI/PI Engineer (TT810ST RM 4382) Key Technical skills:Ansys HFSS, SIwave, SI/PI Analysis, High-Speed Interfaces (PCIe, LPDDR, USB, Ethernet, GMSL, MIPI, FPD-Link) Customer Focus AreasUnderstand interface requirements, perform channel modeling and SI/PI analysis, identify signal/power issues, recommend design improvements Must-Have Deliverables / CapabilitiesPrepare comprehensive SI/PI reports, provide technical recommendations, perform eye analysis, jitter, crosstalk, insertion …

Position: SAP FI Payment Application Expert – (Digital Payments) (TT70ST RM 4371) Software that makes a differenceThis role is within our Commercial Cluster in the Digital Finance area, responsible for building and maintaining solutions for Volvo Cars payment solution built in SAP. We are now looking for a person with solid skills in SAP Payment …

Position: SAP Material Management (MM) (TT70ST RM 4370) We are seeking an SAP Material Management (MM) expert with 8–10 years of hands-on experience in SAP MM business processes, functionalities, and end-to-end implementations. The ideal candidate will have a strong functional background and a proven track record of delivering complex SAP solutions across both ECC and …

Position: Sr Hardware Engineer for Digital HW+ Engineering (TT90ST RM 4369) OverviewWe are looking for a Senior Hardware Engineer to support HARMAN’s Digital HW+ Engineering initiative. The objective is to integrate simulation into Hardware Engineering development processes and establish a reusable digital component library to enable Model-Based Engineering. Responsibilities Required Profile **************************************************************************************************

Position: Sr Mechanical Engineer for Digital HW+ Engineering (TT90ST RM 4368) OverviewWe are looking for a Senior Mechanical Engineer to support HARMAN’s Digital HW+ Engineering initiative. The objective is to integrate simulation into Mechanical Engineering development processes and establish reusable material and simulation libraries to enable Model-Based Engineering. Responsibilities Required Profile ***************************************************************************************************